Dow nas recently introduced a new DOWSIL™ TC-3065 Thermal Gel, a one-part, thermally conductive gel developed to dissipate high amounts of heat away from sensitive electronic components. DOWSIL™ TC-3065 Thermal Gel easily fills gaps due to its excellent wetting ability and can replace fabricated elastomeric thermal pads that may fail to protect electronics from the high heat associated with 5G’s greater power densities. After full curing, Dow’s new thermal gel eliminates silicone oil bleeding and has ultra-low levels of volatile organic compounds (VOCs). To achieve high levels of manufacturing efficiency, DOWSIL™ TC-3065 Thermal Gel supports automatic dispensing and heat curing after assembly. Applications for this innovative new material include telecommunications and data communications equipment.
“Thermal interface materials for 5G technologies need to quickly dissipate high amounts of heat, and electronics manufacturers also need advanced material solutions that support sustainability and efficient assembly,” said Samuel Liu, marketing manager and Communication segment leader, Dow. “New DOWSIL™ TC-3065 Thermal Gel provides an attractive balance of properties that checks all the boxes. This strong new addition to Dow’s growing portfolio of thermally conductive silicones can help drive the development of next-generation applications in a way that is both efficient and environmentally responsible.”
To learn more, visit dow.com/electronics.
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