With the C6032 IPC,the ultra-compact Industrial PC series for universal use now includes a high-end device with PCIe modules for expansion options(on the left with additional 4*USB 3.0,on the right with 4*Ethernet)
Beckhoff Automation recently introduced the new C6032 Industrial PC (IPC). With dimensions of only 129 x 133 x 104 mm, the C6032 Industrial PC extends the range of ultra-compact Industrial PCs by a high-performance device in modular design.
For this purpose, the C6032 adds a further circuit board level to the C6030 single-board Industrial PC, which is comparable in terms of computing power,to allow for accommodation of modular interface and functional extensions. With the use of compact PCIe modules, the C6032 can be optimally adapted to the requirement profile of individual applications.
Equipped with Intel® Core™ i processors of the 6th and 7th generation – up to the Core™ i7 with four 3.6 GHz cores – the C6032 is ideal to support extensive axis controls, complex HMI applications, extremely short cycle times or handling of large data volumes. Both the compact motherboard and the die-cast zinc and aluminium housing have been newly developed in accordance with the familiar high Beckhoff standards such as industrial compatibility, Made in Germany quality, reliability and premium look and feel.
High flexibility through PCIe modules
By means of two PCIe compact module slots, the freely accessible connection area on the front of the device can be flexibly expanded. The first PCIe modules to be available are the following:
– 2 x Gbit Ethernet
– 2 x USB 3.0
– 2 x RS232
– 1 x CP-Link 4
The use of an extremely durable, speed-monitored and controlled fan makes the C6032 suitable for a temperature range of up to 55 °C. Available options are Windows 7 or Windows 10 operating systems as well as a second M.2 SSD in RAID configuration.
The C6032 offers storage capacity of 40 GB M.2 SSD, 3D flash even in the basic configuration. The Microsoft Azure™-certified devices of the ultra-compact IPC series are ideal to meet current requirements in machine building, such as e.g. increasing modularisation, reduced space requirements in control cabinets, increased computing power and growing price pressure.
The new device generation is suitable for use in a broad range of application scenarios such as distributed architectures and current IoT (Internet of Things) or Industrie 4.0 concepts. The computing power is flexibly scalable to suit individual requirements.
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Engineering Review – November 2019
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