Modules world””s first IC embedded power management module for smartphones & tablets

TDK Corporation presents a new series of highly integrated, multi-channel power management modules for smartphones and tablets. Based on TDK’s SESUB technology (semiconductor embedded in substrate), the new module is the world’s first IC embedded power management module for smartphones and tablets. Aimed at reducing lead times and development costs for manufacturers of smartphones and tablets, the new product features a power supply management IC chip that is embedded directly into the substrate.

In combination with newly developed surface-mounted capacitors and power inductors, this results in a space-saving footprint that is up to 60 percent smaller than discrete solutions. The highly integrated module offers advanced multi-channel power management capabilities in a single miniature package with dimensions of only 11.0 mm x 11.0 mm x 1.6 mm.

The major features of the new power management module are its high-efficiency step-down converter power supply in a 5-channel configuration with a maximum output of 2.6 A, and its low-noise, low-loss voltage regulator power supply for up to 23 channels. A highly efficient lithium-ion secondary battery charging circuit is also included. Thanks to the fact that the IC completely embedded in the miniature three-dimensional SESUB structure, the power management module features superior thermal attributes compared with solutions with discrete packaged ICs. The module also offers greatly improved EMC performance due to the self-shielding effect of its design.

The new series meets the emerging needs for miniaturized multifunctional power management modules able to provide all of the functions in a smartphone with exactly the right amount of power, thus contributing to longer battery life.

Glossary

• Multi-channel power management IC: A mixed signal IC that integrates multiple power supply channels and allows command based control of output voltage and current to ensure optimum matching to the respective requirements.
• SESUB (semiconductor embedded in substrate): TDK module technology that integrates multiple ICs in a functional substrate along with other embedded elements and surface-mounted discrete components, thus enabling highly integrated miniaturized modules for a wide range of applications.

Main applications

• Smartphones, conventional mobile phones, tablet PCs and other portable terminals

Main features and benefits

• High-efficiency, 5-channel step-down converter power supply with an output of up to 2.6 A
• Low-noise, low-loss voltage regulator type power supply (max. 23 channels)
• High-efficiency lithium-ion secondary battery charging circuit for up to 4 A
• LCD backlight power supply
• Step-up converter power supply for camera flash
• 16-bit microcontroller
• Flash memory for 256 kB of program data and 8 kB of data memory
• Reference quartz oscillator for real-time clock
• Miniature dimensions of only 11.0 mm x 11.0 mm x 1.6 mm
• Terminals: 0.5-mm pad pitch, 20 x 21 array, 380 pads

About TDK Corporation
TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s portfolio includes electronic components, modules and systems which are marketed under the product brands TDK and EPCOS, power supplies, magnetic application products as well as energy devices, flash memory application devices, and others. TDK focuses on demanding markets in the areas of information and communication technology and consumer, automotive and industrial electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2012, TDK posted total sales of USD 9.9 billion and employed about 79,000 people worldwide.

About TDK-EPC Corporation
TDK-EPC Corporation, a TDK group company, is the manufacturer of TDK’s electronic components, modules and systems and is headquartered in Tokyo, Japan. TDK-EPC was founded on October 1, 2009 from the combination of the electronic components business of TDK and the EPCOS Group. The product portfolio includes ceramic, aluminum electrolytic and film capacitors, ferrites, inductors, high-frequency components such as surface acoustic wave (SAW) filter products and modules, piezo and protection components, and sensors.

For more information
Web: www.epcos.com